What Is the Chip Underfill Dispensing Process?

August 26, 2026 0

底部填充点胶是把胶水灌进芯片与基板缝隙、固化后分散热应力延长焊点寿命的封装工序。流程为清洗、预热、点胶、毛细流动、固化；路径严禁四边围胶，胶量以对侧溢出50%到...

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